Category: Transient Plane Source
Author(s): Hani E. Naguib, Hugo G. Palhares, Min Wen Liu, Shahriar Ghaffari Mosanenzadeh
Keywords: BN, boron nitride, building materials, Concentrations, conducting fillers, construction, electronics packaging, Electronics Packaging Improvement, fiber network, Fillers, hBN, hexagonal boron nitride, hexagonal boron nitride (hBN), LCP, liquid crystal polymer, liquid crystal polymer (LCP), Polymer composites, polymer hybrid, Thermal Conductivity
Abstract: As electronics get smaller and more powerful, the packaging that contains them must in turn become lighter with higher thermal conductivity and electrical resistivity. This study tested the effect of adding highly concentrated hexagonal boron nitride (hBN) fibers to liquid crystal polymer. The fibers were oriented in a way to achieve a high filler concentration, and the composites were then randomly added to a polyactide matrix. The researchers found that the filler interaction affected the thermal conductivity, and that the interaction between them could be controlled by altering the aspect ratio of the fibers. By optimizing the filler concentration, a hybrid composite was produced that had similar thermal conductivity to the pure fiber.
Reference: The Journal of Polymer Science Part B: Polymer Physics (2015)