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Thermal Conductivity Paper Database

Thermtest has compiled the world’s largest thermal conductivity academic paper database. The research paper database is dedicated to the Transient Plane Source (TPS), Transient Hot Wire (THW), Transient Line Source (TLS), and Guarded Heat Flow Meter (GHFM). These techniques offer a wide range of applications, which is represented by more than 1000 papers represented in the database! Search academic papers below:

Recommended Papers for: resin

Total Papers Found: 43

The effect of silanize alumina nano-fillers addition on some physical and mechanical properties of heat cured polymethyl methacrylate denture base material 

Despite its fragility, poor thermal properties, and high water sorption rates, polymethyl methacrylate (PMMA) is commonly used in denture fabrication. This study aimed to examine how the addition of Aluminum oxide nanoparticles affected the properties of PMMA. A thermal constant analyzer measured the thermal properties of the Al2O3 nanoparticles using the transient plane source (TPS) method. Results showed that the thermal conductivity and thermal diffusivity of acrylic resin improved ...

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Thermal conductivity models for single and multiple filler carbon/liquid crystal polymer composites 

Adding conductive fillers to polymer resins improves the thermal conductivity of the polymers. In this study, Thermocarb TC-300 synthetic graphite and Fortafil 243 carbon fiber were added to Vectra A950RX liquid crystal polymer (LCP) to produce anisotropic single and multiple filler composites. A Thermal Constants Analyzer measured the thermal conductivity of the composites using the transient plane source (TPS) technique. The formulations that contained Thermocarb fillers had higher in- and ...

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Thermal conductivity enhancement with different fillers for epoxy resin adhesives

As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...

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Tailoring the structure of cellular vitreous carbon foams

The authors set out to prepare cellular vitreous carbon (CVC) foams with varying thermal and physical properties. This was accomplished by using tannin-based resin modified by different isocyanates in varying amounts. Three different experimental procedures were used to prepare foams with different physical and thermal properties. Physical properties of the foams studied include density, as well as pore volume, pore size and cell diameter. The transient plane source (TPS) technique ...

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Experimental and numerical study of the effective thermal conductivity of nano composites with thermal boundary resistance

Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of ...

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