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Various microfibrillar composites were prepared in situ using boron nitride as a thermally conductive filler. The multistage stretching extrusion process was used in an effort to improve thermal conductivity and mechanical properties. It was found that the addition of laminating-multiplying elements (LMEs) improved the dispersion of BN in the composite polymers and they also improved the tensile and impact strength of the polymers. It was also found that the thermal ...
Polyether Ether Ketone (PEEK)/hexagonal boron nitride (h-BN) nanocomposites were formed by a planetary ball milling process and hot compression molding in order to determine the effect of the addition of h-BN on the properties of PEEK. In particular, the tensile strength, friction and wear behaviors, morphology, hardness, thermomechanical properties, and thermal conductivity of the nanocomposite were examined. Hexagonal boron nitride was added in filler concentrations of up to 5 wt. %. ...
The development of environmentally sustainable materials for use in the management of heat in electronics is becoming increasingly important. Currently the majority of materials that are used for this purpose are oil-based. In this article, the thermal transport, physical, electrical, and mechanical properties of a bio-based polymer matrix (polyactic acid) with embedded hexagonal boron nitride were studied to determine if this would be a practical material for use in the ...
Ultrathin boron nitride nanosheets (BNNSs) were prepared at 300°C by a new variable-pressure one-step synthesis. An increase in pressure during the synthesis results in a decreased thickness for the nanosheets, which were all triangular in shape with zig-zag edges. The synthesized nanosheets exhibit high adsorption capacities for the organic dye methylene blue (MB). In addition to these properties, the BN nanosheets can be used as excellent thermal-conducting additives in BN-polymer ...
The point of this research paper was to modify the thermal and mechanical properties of epoxy resin (EP) via the addition of boron nitride (BN) by a silane coupling agent (KH550). The use of 60 wt.% BN resulted in a thermal conductivity that was 5 times higher than the conductivity of the unmodified epoxy resin....
