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In the present study, boron nitride/dicyclopentadiene bisphenol cyanate ester/bisphenol A dicyanate ester (BN/DCPDCE/BADCy) composites were investigated for the effects of filler mass on thermal and mechanical properties. Thermal conductivity was measured using an instrument by transient plane source method. With the addition of BN fillers for BN/DCPDCE/BADCy composites, the BN-BN connections of inner composites increased and formed more thermally conductive channels, resulting in improved thermal conductivity.
In efforts to develop polymers possessing high thermal conductivity, ultra-high-molecular-weight polyethylene (UHMWPE)/boron nitride particles (BNp), UHMWPE/BN sheets (BNs), and UHMWPE/(BN+MWCNT) hybrid filler composites were analyzed in this study. Thermal conductivity was measured using the transient plane source (TPS) method. Results show that conductive pathways were formed in the composites, increasing both the connection between particles and the thermal conductivity. BNp-filled UHMWPE composites had an overall higher thermal conductivity than BNs composites.
This study aimed at developing polymer-based dielectric materials with high charge-discharge efficiency and large energy density at high temperatures. A polymer nanocomposite was formed using c-BCB polymer matrix with two-dimensional hexagonal boron nitride nanosheets (BNNS). Using a transient technique, thermal conductivity was measured with a Thermal Analyzer. The incorporation of BNNS into PMMA was found to increase thermal conductivity and enhance properties of the nanocomposites.
The effects of the addition of three different fillers to a polymer matrix on the thermo-physical properties of the resulting composites were investigated by the authors. Boron nitride, synthetic diamond, and silicon nitride were used as the fillers (up to 2 vol. %), and it was found that their addition did increase the thermal conductivity relative to that of the pure epoxy matrix. Furthermore, it was determined that the thermal conductivities of the composites increased with increasing filler content, and the maximum thermal conductivity observed in the composites prepared in this work was 78 % higher than that of the pure epoxy matrix. The synthetic diamond filled composites were found to be more thermally stable than the other two types of composites; however, they were found to absorb more moisture than the other composites.
