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In this article, researchers set out to determine the thermal characteristics of boron nitride reinforced high-density polyethylene composites. Various filler contents were studied through thermal characterization and it was determined that the composites containing 30% filler elicited the best thermal insulation and mechanical properties. The results displayed that the lower the filler content, the higher the thermal conductivity of the reinforced composite. Researchers also concluded that the smaller the boron nitride particles, the more easily electrical pathways are formed.
During a melt blending process, carbon nanotubes (CNTs) were added to a poly(vinylidene fluoride)/Boron nitride (PVDF/BN) composite, to increase the thermal conductivity of this polymer composite, for uses in the electronic industry. After this process, the thermal and electrical conductivities, along with any microstructure changes were investigated. It was determined that with the addition of CNTs, the thermal conductivity rating of the composite increased, as well as its crystallinity. Also, as CNTs are added to the composite, BN is dispersed homogeneously within the composite and it does not hinder the adhesion of BN/PVDF. It was also noted that the lower the BN content, the higher the dielectric constant, and therefore a lower amount of dielectric loss occurs. Based on the results received, the PVDF/BN/CNT composite may potentially be used in the electronic industry as a heat conductor.
The transient hot wire (THW) method today is used for the measurement of thermal conductivity, thermal diffusivity and specific heat of liquids and pastes.
Coefficient of Thermal Expansion (CTE) is a measure of the expansion or contraction of a material as a result of changes in temperature. Specifically, it measures the fractional change in size per degree change in temperature at a constant pressure. Several types of coefficients have been developed: volumetric, area, and linear. Microstructural...
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