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As electronics get smaller and more powerful, the packaging that contains them must in turn become lighter with higher thermal conductivity and electrical resistivity. This study tested the effect of adding highly concentrated hexagonal boron nitride (hBN) fibers to liquid crystal polymer. The fibers were oriented in a way to achieve a high filler concentration, and the composites were then randomly added to a polyactide matrix. The researchers found that the filler interaction affected the thermal conductivity, and that the interaction between them could be controlled by altering the aspect ratio of the fibers. By optimizing the filler concentration, a hybrid composite was produced that had similar thermal conductivity to the pure fiber.
This study aimed to enhance the thermal and mechanical properties of polyethylene (PE)/boron nitride (BN) composites by manipulating the BN concentrations in the matrix and by applying shear fields in laminating-multiplying elements (LMEs). A thermal constants analyze measured the thermal conductivity of the PE/BN composites using the transient plane source (TPS) method. Results showed that the thermal conductivity of the composites increased with BN concentration. As well, the high intensity shear field enhanced the dispersion of the highest concentration of BN fillers which improved thermal conductivity.
Adding metallic nanoparticles to a conventional fluid increases the thermal conductivity of the solution. In this study, flaked boron nitride (BN) and high-aspect-ratio multi-walled carbon nanotubes (MWCNTs) were added to epoxy composites to increase thermal conductivity. A thermal analyser measured the thermal conductivity of the nanofluids using the transient plane source (TPS) method. Results showed that adding a small volume of MWCNT to the epoxy composite significantly improved thermal conductivity compared to when pristine CNTs were used. It was also noted that the thermal conductivity of the composite increased with concentration of BN.
Various microfibrillar composites were prepared in situ using boron nitride as a thermally conductive filler. The multistage stretching extrusion process was used in an effort to improve thermal conductivity and mechanical properties. It was found that the addition of laminating-multiplying elements (LMEs) improved the dispersion of BN in the composite polymers and they also improved the tensile and impact strength of the polymers. It was also found that the thermal conductivity was increased when this method was used and that the thermal conductivity could be calculated based on filler and LME content by modifying a previously determined equation.
Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather the increased ability of these particles to interact with one another. It was found that the hexagonal boron nitride fibers forming networks increased the thermal conductivity when compared with composites containing uniformly dispersed filler particles.
