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Recommended Papers for: TIMs

Total Papers Found: 14

Thermal contact resistance of epoxy composites incorporated with nano-copper particles and the multi-walled carbon nanotubes

Raw multi-walled carbon nanotubes (r-MWCNTs) and Cu nanoparticles are dispersed in an epoxy matrix in varying quantities to create composite polymers with enhanced thermal conductivities. A study was then conducted to determine if the boundary thermal contact resistance could be reduced by increasing the thermal conductivity. The boundary thermal contact resistance was found to be approximately constant across all samples containing the copper nanoparticles. The boundary thermal contact resistance was ...

Author(s): , ,

Thermal interface materials based on carbon nanotubes and their thermal characterization

The effects of using different fillers and the effects of filler content and particle size on the thermal properties of thermal interface materials were investigated. The most prominent enhancement in thermal conductivity was observed for samples containing carbon nanotubes and graphite. The filler particle size was also found to significantly affect the thermal conductivity, as smaller fillers resulted in a higher thermal conductivity. The article also describes two sample holders ...

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Graphite nanoplatelet/silicone composites for thermal interface applications

Graphite nanoplatelets were dispersed in varying quantities into a silicone matrix to form composite materials with higher thermal conductivities than the pure silicone matrix without sacrificing mechanical properties. It was found that the thermal conductivities of the composites increased with increasing GNP content as well as with increasing GNP particle size. The composites were found to be effectively electrically insulating, and it was found that the addition of GNP did ...

Author(s): , ,

Enhanced thermal and mechanical properties of epoxy composites filled with silver nanowires and nanoparticles

The authors have investigated the use of silver nanomaterials as a filler in epoxy resin in an effort to identify a composite resin with a high thermal conductivity for application as a thermal interface material. It was determined that the addition of silver nanoparticle and silver nanowires both increased the thermal conductivity of the resin, but the silver nanowires caused a much more drastic increase. It was found that by ...

Author(s): , , , , , ,

The heat is on: graphene applications

As electronic devices approach nanometer scales, heat distribution becomes nonuniform and hot spots begin to form. Integrating graphene into nanoelectronics enhances thermal conductivity and heat flow which mitigates hot spots. In this experiment, large quantities of graphene were produced and thermal conductivity was measured by the transient plane source (TPS) method using an instrument. Results showed that the addition of graphene greatly improved the thermal conductivity of the thermal interface ...

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