Thermal Conductivity Paper Database

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Recommended Papers for: Shie-Heng Lee

Total Papers Found: 2

Enhanced thermal and mechanical properties of epoxy composites filled with silver nanowires and nanoparticles

The authors have investigated the use of silver nanomaterials as a filler in epoxy resin in an effort to identify a composite resin with a high thermal conductivity for application as a thermal interface material. It was determined that the addition of silver nanoparticle and ...

Author(s): , , , , , ,

Thermal conductivity and structure of non-covalent functionalized graphene/epoxy composites

As technology advances, the need for inexpensive polymer-based composites possessing high thermal conductive properties has become more and more important. Previously, the addition of thermal conductive particles, such as alumina, boron nitride and alumina nitride, has caused an increase in the thermal conductivity of the ...

Author(s): , , , , , , , ,

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