Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
The authors have investigated the use of silver nanomaterials as a filler in epoxy resin in an effort to identify a composite resin with a high thermal conductivity for application as a thermal interface material. It was determined that the addition of silver nanoparticle and silver nanowires both increased the thermal conductivity of the resin, but the silver nanowires caused a much more drastic increase. It was found that by ...
As technology advances, the need for inexpensive polymer-based composites possessing high thermal conductive properties has become more and more important. Previously, the addition of thermal conductive particles, such as alumina, boron nitride and alumina nitride, has caused an increase in the thermal conductivity of the composite. Although an increase in thermal conductivity is present, an increase in fabrication costs is also experienced as a higher quantity of particles is required, ...
