Category: Transient Plane Source
Author(s): Alexander A. Balandin
Keywords: carbon, Carbon nanotubes, Circuits, CNTs, Computer chip, density, Electronics Industry, Frequency, graphene, Heat distribution, Heat removal, Hot spots, Liquid cooling, Multicore design, Nanometer, Non-uniformity, Optoelectronic, power, Processors, Thermal Conductivity, thermal interface materials, TIMs, Transient plane source (TPS), Transient plane source (TPS) method
Abstract: As electronic devices approach nanometer scales, heat distribution becomes nonuniform and hot spots begin to form. Integrating graphene into nanoelectronics enhances thermal conductivity and heat flow which mitigates hot spots. In this experiment, large quantities of graphene were produced and thermal conductivity was measured by the transient plane source (TPS) method using an instrument. Results showed that the addition of graphene greatly improved the thermal conductivity of the thermal interface materials (TIMs) at a lower cost than typical carbon enhancers. Because of its high thermal conductivity and low cost, graphene has the potential to be the material of choice for thermal management in nanoelectronics in the future.
Reference: Nanotechnology Magazine, 5, 4 (2011) pp. 15-19
DOI: 10.1109/MNANO.2011.943327