Category: Transient Plane Source
Author(s): Chen-Chi M. Ma, Chih-Chun Teng, Hsi-Wen Tien, Ikai Wang, Shie-Heng Lee, Yi-Hsiuan Yua, Yuan-Li Huang
Keywords: Adhesive Bonding Measurement, density, Epoxy, Fillers, Nanoparticles, Polymer composites, resin, Scanning Electron Microscope, Scanning electron microscope (SEM), SEM, thermal interface materials, Thermal-Conductivity Coefficient, TIMs, transient plane source method
Abstract: The authors have investigated the use of silver nanomaterials as a filler in epoxy resin in an effort to identify a composite resin with a high thermal conductivity for application as a thermal interface material. It was determined that the addition of silver nanoparticle and silver nanowires both increased the thermal conductivity of the resin, but the silver nanowires caused a much more drastic increase. It was found that by using nanowires instead of nanoparticles, six times less silver can be used and the weight of the composite resin can be decreased by over fifty percent. It was concluded that silver nanowires could potentially be used to increase the thermal conductivity of polymer composites.
Reference: Journal of the Taiwan Institute of Chemical Engineers, 44, 4 (2013) 654-659
DOI: 10.1016/j.jtice.2013.01.001