The development of higher power chips in the electronics industry has led to the requirement of high performance thermal interface materials (TIMs) due to the increased heat output by these chips. Desirable features of a high performance TIM include that the material be highly thermally conductive, and that it should have a relatively low viscosity. Companies can spend long periods of time trying to find the amount of filler content ...
Through the dispersion of graphite nanoplatelets in a silicone matrix and mechanical mixing, graphite nanoplatelet/silicone composites were prepared. These composites were subsequently analyzed by the transient plane source (TPS) technique in order to determine thermal conductivity. DSC and XRD were used to further characterize the composites....
Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of ...
Using a three-roll mill process, graphite nanoplatelets (GNPs) were dispersed in a silicone polymer for application as a thermal interface material. Through the use of electron microscopy and XRD, the researchers were able to determine that the GNPs dispersed better when using the three-roll milling process as compared to previously used methods. GNPs were mixed with the silicone polymer in wt.% up to 25, with the highest wt.% yielding the highest ...
Using few-layer graphene (FLG) flakes the authors are able to create graphene composites (where graphene is a filler) and measure the thermal properties of these composites using a laser flash technique. In some cases, the thermal conductivity was increased by ten times while only using 5 vol.% graphene as filler. Graphene would make a good filler for thermal interface materials....
