Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable ...
In this paper, the authors discuss the preparation of microencapsulated phase change materials (PCMs). The PCMs used in this study were n-hexadecane and n-octadecane, and the shell was made up of poly(urea-formaldehyde). The effect of dispersing silver nanoparticles in the shells on the thermal storage properties of these encapsulated PCMs was also investigated. The enthalpies of fusion of the samples were determined experimentally, as was the thermal conductivity. It ...
The thermal conductivity of hydrate-layer sediment recovered from a location near Japan was measured at temperatures ranging from 263-283 K, and at a pressure of 0.1 MPa. The thermal conductivity of Toyoura standard sand as a comparison. The thermal conductivity of the methane hydrate-bearing sediment was found to be lower than that of the standard sand at the same temperature. These samples were then measured at conditions similar to those below ...
Lightweight LED heat sinks were fabricated by high-vacuum die casting (HVDC) using the aluminum alloy ADC12. Thermal characteristics of the heat sink were determined under natural convection using thermocouples and an IR thermograph, and the thermal conductivity was measured using the transient plane source (TPS) technique. It was determined that the castings were non-homogeneous and anisotropic....
Raw multi-walled carbon nanotubes (r-MWCNTs) and Cu nanoparticles are dispersed in an epoxy matrix in varying quantities to create composite polymers with enhanced thermal conductivities. A study was then conducted to determine if the boundary thermal contact resistance could be reduced by increasing the thermal conductivity. The boundary thermal contact resistance was found to be approximately constant across all samples containing the copper nanoparticles. The boundary thermal contact resistance was ...
