This research paper delves into the thermal conductivity monitoring of silicone-based electronic materials with various fillers, using the Transient Plane Source (TPS) technique. Aside from the results, researchers also highlight the main features of the TPS technique: a rapid, precise and non-invasive method for measuring thermal properties of various materials. The results received using the TPS technique match those received using other techniques, however when using the TPS technique 30 tests ...
Thermal conductivity testing was done on nitrogenated ultrananocrystalline diamond films on silicon. Temperature dependence on thermal conductivity was measured using these two techniques. A decrease in thermal conductivity was observed with the introduction of nitrogen addition. It was observed that MCD had the highest thermal conductivity followed by UNCD at 25% nitrogen and UNCD at 0% nitrogen....
Thermal conductivity measurements of the same samples were carried out using the TPS method. Thermal testing on carbon nanotubes to study for promising fillers. Thermal conductivity of single-walled carbon nanotubes should enable a further reduction in the filler content required for a given enhancement in the composite properties. For the multi-walled carbon nanotube thermal conductivity increased modestly using this method whereas for the single-walled carbon nanotubes the thermal conductivity was ...
