In this study, ultralow density silica aerogels were synthesized and their thermal conductivities were tested to determine how supercritical drying affected the samples. A thermal analyzer measured the thermal conductivity of the silica aerogels using the transient plane source (TPS) method which determined that the thermal conductivity of silica aerogels increased with temperature....
The first soy and tannin based organic aerogels with 91% naturality have been developed by researchers, and they have low bulk density but high volumes of mesopores. In this experiment, the transient plane source (TPS) method was used to measure the thermal characteristics of the organic aerogels. Results showed that these novelty aerogels are ecologically friendly because they are low cost and renewable but have attractive thermal properties....
Phase change materials (PCMs) store large amounts of latent heat over small temperature ranges, so their application in the thermal regulation of buildings is becoming more popular. However, PCMs have low thermal conductivities, so micro-encapsulated PCMs (micro-PCMs) are being incorporated into PCMs to enhance their performance and improve thermal conductivity. In this study, micro-PCMs were mixed with thermally conductive, inorganic gypsum powder and glass fiber to produce gypsum boards. The ...
Various microfibrillar composites were prepared in situ using boron nitride as a thermally conductive filler. The multistage stretching extrusion process was used in an effort to improve thermal conductivity and mechanical properties. It was found that the addition of laminating-multiplying elements (LMEs) improved the dispersion of BN in the composite polymers and they also improved the tensile and impact strength of the polymers. It was also found that the thermal ...
Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...
