In this article, researchers set out to determine the thermal characteristics of boron nitride reinforced high-density polyethylene composites. Various filler contents were studied through thermal characterization and it was determined that the composites containing 30% filler elicited the best thermal insulation and mechanical properties. The results displayed that the lower the filler content, the higher the thermal conductivity of the reinforced composite. Researchers also concluded that the smaller the boron nitride ...
This study primarily focuses on the electrical and thermal conductivity of nanoparticle filled epoxy resins. Modification of polymers on a nanstructure level has revealed a new world of possibilities for multi-functional materials. Research has found that carbon nanotubes may have the potential to improve mechanical performance of conductive polymers. This research studies the thermal performance of the resins with respect to various types of carbon nanotubes, various concentrations of filler ...
In this study, the thermal conductivity of alkanes was altered, by using inverse micellar templating and nanofibers. The main goal of this study was to create alkanes with tunable thermal conductivities, for their use as phase change materials in heat management. The thermal conductivity of an n-hexadecane product with inverse micelles of different volume fractions was analyzed. The tunable thermal conductivity of the micelle templated alkaline was determined to be ...
The need for higher thermal conductivity fillers, such as aluminum nitride, to deal with an increase in the heat output from future semiconductors has arisen, as most of them are now packaged in a silica epoxy polymer composite. Thermal conductivity testing was performed on the aluminum nitride composite using a thermal constants analyzer and the highest reading was 3.39 W/mK, approximately 15 times higher than pure epoxy. Based on the results, ...
In this article, researchers studied the effect of particle shape on the thermal conductivity of copper reinforced polymer composites. Short-fiber shaped polyamide composites with filler content ranging from 0 to 30 % were measured, alongside of polyamides containing 0 to 60 % filler, shaped as spheres and plates. When the filler content is low, particles are not interacting with each other, and therefore the thermal conductivity is low. As the filler percentage increases to 10%, an immediate ...
