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Recommended Papers for: Daniel J. Shanefield

Total Papers Found: 1

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

The need for higher thermal conductivity fillers, such as aluminum nitride, to deal with an increase in the heat output from future semiconductors has arisen, as most of them are now packaged in a silica epoxy polymer composite. Thermal conductivity testing was performed on the aluminum nitride composite using a thermal constants analyzer and the highest reading was 3.39 W/mK, approximately 15 times higher than pure epoxy. Based on the results, ...

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