Category: Transient Plane Source
Author(s): Daniel J. Shanefield, Eun-Sung Lee, Sang-Mock Lee, W. Roger Cannon
Keywords: Epoxy, Fillers, integrated circuit chips, particle size, Polymer composites, resin, Temperature, Thermal Conductivity, thermal expansion coefficient
Abstract: The need for higher thermal conductivity fillers, such as aluminum nitride, to deal with an increase in the heat output from future semiconductors has arisen, as most of them are now packaged in a silica epoxy polymer composite. Thermal conductivity testing was performed on the aluminum nitride composite using a thermal constants analyzer and the highest reading was 3.39 W/mK, approximately 15 times higher than pure epoxy. Based on the results, the potential replacement of silica epoxy composites, with aluminum nitride composite to encapsulate circuit chips is highly plausible.
Reference: Journal of American Ceramic Society 91 (2008) 1169-1174
DOI: 10.1111/j.1551-2916.2008.02247.x