Thermal Conductivity Paper Database

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Recommended Papers for: Eun-Sung Lee

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Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

The need for higher thermal conductivity fillers, such as aluminum nitride, to deal with an increase in the heat output from future semiconductors has arisen, as most of them are now packaged in a silica epoxy polymer composite. Thermal conductivity testing was performed on the ...

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