Category: Transient Plane Source
Keywords: admiceller polymerization process, boron nitride, Epoxy, interfacial adhesion, molar ratio, monomer, poly(methyl methacrylate), Polymer composites, polystrene, resin, SEM micrographs, silane treatment, solubility parameter concept, surface modification, surfactant, Thermal Conductivity, wettability
Abstract: The purpose of this research was to improve the thermal conductivity of boron-nitride filled epoxy composites. To complete this task, the interfacial adhesion in the composite needed to be improved. This was achieved by employing admicellar polymerization to coat the polystyrene and polymethyl methacrylate, on the boron nitride surface. The results indicated an increase in the thermal conductivity of the composite from 1.5 W/mK, with the use of untreated boron-nitride, to 2.69 W/mK with the use of treated admicellar boron nitride. This increase in thermal conductivity indicates an improvement in the interfacial adhesion between the boron nitride and the epoxy resin.
Reference: Journal of Applied Polymer Science, 119, 6 (2011) 3234-3243