Category: Transient Plane Source
Author(s): H. Manuspiya, K. Wattanakul, N. Yanumet
Keywords: BN, boron nitride, composites, Epoxy, Fillers, mechanical properties, mixing speed, sonication, Temperature, Thermal Conductivity, viscosity
Abstract: Boron Nitride filled epoxy composites are explored on a thermal and mechanical scale within this research article. Researchers took special interest in the effect of filler content, mixing conditions and Boron Nitride agglomerate size, on the thermal conductivity of the composite. Experimental results alluded to an increase in thermal conductivity, as filler content, and mixing speed, time and temperature increased. On the other hand, as the Boron Nitride agglomerate size increased, the thermal conductivity of the composite decreased. As a results, sonication should be used, as opposed to mechanical mixing, to decrease the agglomerate size within the composite and therefore, increase the thermal conductivity.
Reference: Journal of Composite Materials, (2011)
DOI: 10.1177/0021998310393297