Category: Transient Plane Source
Author(s): Hai-Yuan Qi, Hui-Rong Li, Jing Dang, Ya-Jun Luo
Keywords: Casting Method, composites, differential scanning calorimetry, Differential scanning calorimetry (DSC), DSC, EP/SiC, Epoxy, Flexural Strength, Glass Transition Temperature, Heat Resistance, Impact Strength, mass fraction, resin, Scanning Electron Microscopy, Scanning Electron Microscopy (SEM), SEM, Silicon Carbide, Silicon Carbide (EP/SiC) Composites, TGA, Thermal Conductivity, Thermogravimetric Analysis, Thermogravimetric analysis (TGA)
Abstract: Epoxy resin/silicon carbide (Ep/SiC) composites were prepared by the casting method and subsequently characterized for their mechanical and thermal properties. It was determined that an increasing mass fraction of SiC in the epoxy resin resulted in increasing thermal conductivity of the composites. Using 50 wt.% SiC resulted in a thermal conductivity of 0.7152 W/mK, which is three times that of pure epoxy resin. Mechanical properties peaked with 10 wt.% SiC. A machine was used to measure the thermal properties of the composites, and DSC and TGA were used to reinforce the results. Impact fracturing was investigated using SEM.
Reference: Polymer-Plastics Technology and Engineering, 48, 8 (2009) 877-881
DOI: 10.1080/03602550902994953