A study of the through-plane thermal conductivity of various gas diffusion layer materials (GDL) and the thermal contact resistance between the GDL and an electrolytic iron surface as a function of compression load. These factors were anaylized ...
Thermal interface materials (TIMs) are often used in electronic and microelectronic applications. It can be difficult to determine their characteristics once they are in-situ because it is hard to account for the surface roughness and waviness of the objects the TIM is applied to. This ...
