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Recommended Papers for: Peter Teertstra

Total Papers Found: 1

Thermal Conductivity and Contact Resistance Measurements for Adhesives

Thermal adhesives that contain large proportions of high thermal conductivity filler materials are extremely useful in electronics and manufacturing. Due to the importance of these fillers it is crucial to know their exact properties. Five adhesives are examined for their thermal conductivities. These values were obtained using a guarded heat flow meter with a method following the ASTM test standard. This method ...

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