Keywords: , , , , , , , ,

Abstract: Thermal adhesives that contain large proportions of high thermal conductivity filler materials are extremely useful in electronics and manufacturing. Due to the importance of these fillers it is crucial to know their exact properties. Five adhesives are examined for their thermal conductivities. These values were obtained using a guarded heat flow meter with a method following the ASTM test standard. This method gave an uncertainty value in the measurements of 3.5%.

Reference: Conference: ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference

DOI: 10.1115/IPACK2007-33026