Category: Transient Plane Source
Author(s): Yi He
Keywords: electronic packaging, Temperature, Thermal Conductivity, thermal grease, thermal interface materials, TIMs
Abstract: The transient plane source method was used to perform thermal conductivity, thermal diffusivity, and specific heat capacity measurements. Thermal transport properties of several thermal greases were characterized using TPS and data were compared to supplier data, received by other methods, to determine accuracy of the TPS method.
Reference: Thermochimica Acta 436 (2005) 130-134