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Recommended Papers for: Copper

Total Papers Found: 30

Effect of pH and chemical surfactant on thermal conductivity enhancement of Cu-H2O nanofluids 

This study investigates the effect changing the PH of a copper nanofluid and sodium dodecylbenzenesulfonate (SDBS) surfactant concentration has on the thermal conductivity of the nanofluid. The thermal conductivity was determined through the Hot Disk Transient Plane (TPS) method. As the PH is increased the thermal conductivity also increases because higher PH means more surface charges which increase conductivity.  As the SDBS concentration is increased the thermal conductivity slightly increases ...

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Carbon nanotubes based engineering materials for thermal management applications

As nanotechnology becomes increasingly important, researchers are investigating methods to decrease the size of electronics. Carbon nanotubes (CNTs) have potential applications in nanoelectronics because of their high thermal conductivity and miniscule size. This study had many focuses, but a TPS used the transient plane source method to specifically measure the thermal conductivities of CNT-fabricated thermal pastes. Results showed that the thermal conductivities varied depending on filler content, but were comparable ...

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Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites 

Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- and chromium-diamond composites (uncoated (Cu/D), Cu-coated (Cu/CuD), and Cr-coated (Cu/CrD)) were produced to determine their potential use in heat sink applications. A Thermal Constant Analyzer measured the thermal conductivity of the matrix and composite samples using the ...

Author(s): , , ,

Temperature-dependent thermal conductivity of eicosane-based phase change materials with copper oxide nanoparticles

In this study, pure eicosane and eicosane-CuO solid composites were prepared using ambient and ice-water bath solidification methods. A Thermal Constants Analyzer measured the thermal conductivity of the samples using the transient plane source (TPS) technique. Results showed that for both solidification methods, composite thermal conductivity was independent of temperature up to a point, and the composites with the highest nanoparticle concentrations had the highest thermal conductivity. Although the composites ...

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Preparation and thermal characterization of paraffin/metal foam composite phase change material 

Paraffin is an excellent phase change material (PCM) for latent heat storage, but it does not efficiently use stored energy because of its low thermal conductivity. In this study, nickel and copper foams were added to paraffin to enhance heat transfer. A Thermal Constants Analyzer measured the thermal conductivity of the paraffin composites using the transient plane source (TPS) method. The addition of copper foam enhanced the thermal conductivity of ...

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