Category: Transient Plane Source
Keywords: Copper, copper oxide, Copper oxide (CuO), Eicosane based, liquid, Nanoparticles, pcms, phase change materials, solid, Temperature, Thermal Conductivity, thermal constants analyser, Transient plane source (TPS), Transient plane source (TPS) method
Abstract: In this study, pure eicosane and eicosane-CuO solid composites were prepared using ambient and ice-water bath solidification methods. A Hot Disk Thermal Constants Analyzer TPS 500 measured the thermal conductivity of the samples using the transient plane source (TPS) technique. Results showed that for both solidification methods, composite thermal conductivity was independent of temperature up to a point, and the composites with the highest nanoparticle concentrations had the highest thermal conductivity. Although the composites relatively all followed the same trend, the samples prepared by ice-water solidification had lower thermal conductivities than those prepared by the ambient solidification method.
Reference: International Centre for Heat and Mass Transfer; Digital Library, (2011)