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Recommended Papers for: Copper

Total Papers Found: 30

Reducing thermal contact resistance using a bilayer aligned CNT thermal interface material

Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...

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Influence of pH and SDBS on the Stability and Thermal Conductivity of Nanofluids

This experiment outlined an investigation into heat transfer of two water-based nanofluids; H2O-Al2O3 and H2O-Cu. The absorbency and thermal conductivity of both nanofluids was measured under various pH values and sodium dodecylbenzene sulfonate (SDBS) concentrations, to determine whether an effect on heat transfer is present. The results concluded that the stability and thermal conductivity of the nanofluids are greatly dependent on the pH values and SDBS concentrations ...

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Effect of Particle Shape on Thermal Conductivity of Copper Reinforced Polymer Composites

In this article, researchers studied the effect of particle shape on the thermal conductivity of copper reinforced polymer composites. Short-fiber shaped polyamide composites with filler content ranging from 0 to 30 % were measured, alongside of polyamides containing 0 to 60 % filler, shaped as spheres and plates. When the filler content is low, particles are not interacting with each other, and therefore the thermal conductivity is low. As the filler percentage increases to 10%, an immediate ...

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Thermal conductivity, thermal diffusivity, and specific heat of samples from transient measurements 

This research article proposes the use of a thermal constants analyzer to measure thermal properties of relatively thin samples. Five different metallic samples containing copper, aluminum and brass were used to test the accuracy of the new and improved method. Previously, this method has been used to test the thermal properties of thin metallic sheets, however with the new and improved method, it is possible to measure samples with thicknesses ...

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Thermal Conductivity Enhancement Dependent pH and Chemical Surfactant for Cu-H2O Nanofluids

Thermal conductivity of heating and cooling fluids with added nanoparticles dubbed 'nanofluids' are used as potential to improve the efficiency of heat transfer fluids using a thermal constants analyser. The Thermal conductivity enhancements of Cu-H2O nanofluids are dependent on the weight fraction of nanoparticles, pH values and sodium dodecylbenzenesulfonate (SDBS) surfactant concentration of nano-suspensions. Combining both the pH and chemical surfactant is recommended to improve the thermal conductivity for ...

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