Nanoparticle-enhanced phase change materials (NePCMs) are nanofluids that can be used for thermal energy storage when they undergo solid-liquid phase transitions. In this study, a Thermal Constants Analyzer (TPS) measured the thermal conductivity of eicosane-based NePCM samples using the transient plane source (TPS) method. Results showed that thermal conductivity of the solid composites increased with temperature, and eicosane-CuO samples that solidified in an ice-water bath had the lowest thermal conductivities, ...
Polyoxymethylene (POM) is a resistant polymer with wide applications in aerospace, automotives, and biomedicine. However, it falls short when used in the manufacturing of sliding parts. In this study, copper particles and polytetrafluoroethylene (PTFE) powder were incorporated into POM to improve the thermal conductivity of the polymer composite while reducing the friction coefficient. A thermal analyzer was used to measure the thermal conductivity of POM composites using the transient plane ...
As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...
Through the addition of copper oxide nanoparticles to cyclohexane in varying concentrations, a series of nano-enhanced phase change materials (NePCM) were prepared. The transient plane source (TPS) technique was used to characterize the NePCM at multiple temperatures. It was determined experimentally that increasing concentrations of nanoparticles in the liquid phase resulted in increasing thermal conductivity, but increasing nanoparticle concentration in the solid phase didn't have the same effect.Unidirectional freezing ...
Copper powder was used a filler and added to a polyamide matrix in order to generate copper reinforced polyamide composites. The copper powder came in three different forms: short fibers, plates and spheres. The short fibers were added to the polyamide matrix at a vol.% up to 30, and the plates and spheres up to 60 vol.%. Thermal conductivity was measured and it was found that at filler amounts below 10 vol.% the ...
