1-Dimensional > Thin-film
Thin-Film

Thermal Conductivity of Thermal Management Materials

Measure the performance of applied Thermal Management Materials (TMMs) between the application, connecting materials and surface finish.
MP-1 TPS with Thin Film

MP-1 TPS Thin Films

  • Thermal Conductivity
  • Thermal Resistance
  • Adhesives
  • Tapes
  • TIMs
  • Films

Applications

dry contact
Dry Contact
Adhesives
Adhesives
Tapes
Tapes
TIMs
TIMs
Films
Films

Connecting Material

Surface Finish

Metals
Metals
Polymers
Polymers
Rough
Rough
Metals
Smooth
L

Conditions

temperature
Temperature
pressure
Pressure
thickness
Thickness
Sample
Adhesive
Tape
Tape with Liner
Silver Filled Epoxy
TIM
Thickness (mm)
0.063
0.200
0.190
0.050
0.230
Measured Thermal
Resistance
(10-3 m²K/W)
0.414
1.053
0.456
0.044
0.450
Calculated Thermal
Conductivity (W/m·K)
0.151
0.190
0.162
1.160
0.511
Measured Bulk Thermal
Conductivity (W/m·K)
0.197
0.207
0.240
1.699
0.500
Direct measurement of bulk thermal conductivity is best suited for the specification sheets of TMMs. Measured thermal resistance and thermal conductivity of TMMs may differ depending on bond line thickness, connecting materials and surface finish. The MP-1 TPS Thin-film Module measures the performance of TMMs in their applied use.