Category: Transient Plane Source
Author(s): Craig Dixon, Michael R. Strong, S. Mark Zhang
Keywords: Fillers, Macro and micro electronic applications, Macro electronic applications, micro electronic applications, Silicone, Silicone-based electronic materials, Thermal Conductivity, Thermal Properties, Transient Plane Source Technique
Abstract: This research paper delves into the thermal conductivity monitoring of silicone-based electronic materials with various fillers, using the Transient Plane Source (TPS) technique. Aside from the results, researchers also highlight the main features of the TPS technique: a rapid, precise and non-invasive method for measuring thermal properties of various materials. The results received using the TPS technique match those received using other techniques, however when using the TPS technique 30 tests may be performed a day, compared to the 2 tests a day with other techniques. All thermal conductivity results received were well within the +/- 2% range and correlated with published data of tested materials.
Reference: The International Journal of Microcircuits and Electronic Packaging, 23, 4 (2000) pp. 494-500
DOI: N/A