Transient Plane Source Technique for Measuring Thermal Properties of Silicone Materials Used in Electronic Assemblies
Author(s): Craig Dixon, Michael R. Strong, S. Mark Zhang
This research paper delves into the thermal conductivity monitoring of silicone-based electronic materials with various fillers, using the Transient Plane Source (TPS) technique. Aside from the results, researchers also highlight ...
Keywords: Fillers, Macro and micro electronic applications, Macro electronic applications, micro electronic applications, Silicone, Silicone-based electronic materials, Thermal Conductivity, Thermal Properties, Transient Plane Source Technique
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