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Thermal Conductivity Paper Database

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Recommended Papers for: Temperature

Total Papers Found: 136

Reference Correlations of the Thermal Conductivity of Ethene and Propene

Wide-range reference temperature-and-density based equations for the thermal conductivity of ethene and propene are given. These equations are based upon a body of critically assessed data, acquired partially using the transient hot wire method. The ethene correlation is valid from 110 to 680 K and up to 200 MPa with a maximum uncertainty of 5%. The propene correlation from 180 to 625 K at pressures up to 50 MPa, with an uncertainty of 5%....

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Reference Correlation of the Thermal Conductivity of n-Heptane from the Triple Point to 600 K and up to 250 MPa

New representative reference equations for the thermal conductivity of n-heptane are expressed based on experimental data that has been critically assessed for consistency and for agreement with theory. A large part of the data was collected by the transient hot wire method. The theoretically expected enhancement in the critical region agrees with the data collected and can be well represented by theoretically based equations containing just one adjustable parameter. The ...

Author(s): , , , , ,

Reference Correlation of the Thermal Conductivity of Toluene from the Triple Point to 1000 K and up to 1000 MPa

New representative equations for the thermal conductivity of toluene are expressed based on a body of experimental data collected mainly by the transient hot wire method. The data has been critically assessed for consistency and agreement with theory wherever possible. Due to the difficulties of the substance, data in the critical region is scarce. The data that was collected agreed with the theoretical enhancement expected in that region and can ...

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A Novel Portable Absolute Transient Hot-Wire Instrument for the Measurement of the Thermal Conductivity of Solids

A new design was presented of a portable transient hot wire apparatus for measuring the thermal conductivity of solids. The design features a two-wire sensor with silicon layers, compact printed electronic board and a high-tech software suite that utilizes the Finite Elements Method to model heat flow. This methodology is 120x's faster than any previous approach and can reduce the number of ...

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Thermal Conductivity of Molten Lead-Free Solders

This paper investigates the thermal capacity of multiple varieties of lead-free molten solder for application in electrical equipment. An accurate understanding of these properties would lead to a better controlled soldering process. Measurements are taken by a transient hot wire that was originally designed to be used on pure molten metals, but an improved finite-element code analyzed the data (this is called FE modeling). The measurements are taken from the ...

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