Category: Transient Plane Source
Author(s): Jin Kon Kim, Jong Won Kim, Min Seok Song, Myung Im Kim
Keywords: 2-ethylexyl acrylic polyol, Adhesion properties, Coupling agent, cross linking, diameter, matrix, particle, particle size, resin, strength, Thermal barrier, Thermal Conductivity, thermal transport properties, Transient plane source (TPS), Transient plane source (TPS) method, Ultraviolet
Abstract: Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the thermal conductivity of TC-PSA. A thermophysical properties analyzer measured the thermal conductivity of the particle-filled polymer using the transient plane source (TPS) method. Results showed that the thermal conductivity of the particles increased with diameter and aspect ratio, and the addition of GSP enhanced the thermal conductivity of TC-PSA.
Reference: Macromolecular Research, 14, 5 (2006) 517-523