Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the thermal conductivity of TC-PSA. A thermophysical properties analyzer measured the thermal conductivity of the particle-filled ...
In this article, researchers studied the effect of particle shape on the thermal conductivity of copper reinforced polymer composites. Short-fiber shaped polyamide composites with filler content ranging from 0 to 30 % were measured, alongside of polyamides containing 0 to 60 % filler, shaped as spheres and plates. When the filler ...
