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Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the thermal conductivity of TC-PSA. A thermophysical properties analyzer measured the thermal conductivity of the particle-filled polymer using the transient plane source (TPS) method. Results showed that the thermal conductivity of the particles increased with diameter and aspect ratio, and the ...
In this article, researchers studied the effect of particle shape on the thermal conductivity of copper reinforced polymer composites. Short-fiber shaped polyamide composites with filler content ranging from 0 to 30 % were measured, alongside of polyamides containing 0 to 60 % filler, shaped as spheres and plates. When the filler content is low, particles are not interacting with each other, and therefore the thermal conductivity is low. As the filler percentage increases to 10%, an immediate ...
