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  - Column 1
    - HFM-100Heat Flow Meter
    - TLS-100Transient Line Source
    - THW-L1Transient Hot Wire
    - THW-L2Transient Hot Wire
    - GHFM-02Guarded Heat Flow Meter
    - TPS-EFFTransient Plane Source
  - Column 2
    - TPSTransient Plane Source
    - SSTR-FSteady-State ThermoReflectance Fiberoptics
    - MP-2Measurement Platform
  - Column 3
    - DSC-L600Differential Scanning Calorimeter
    - TGA-1000Thermogravimetric Analyzer
    - TGA-1500Thermogravimetric Analyzer
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  - Thermophysical Analysis
    - Heat Flow Meter, HFM-100Integrated Temperature & Automation
    - Transient Hot Wire, THW-L1 & THW-L2Thermal Conductivity, Thermal Diffusivity & Specific Heat
    - Transient line Source, TLS-100Thermal Conductivity & Thermal Resistivity
    - Measurement Platform, MP-2Thermal Conductivity
    - Steady-State ThermoReflectance, SSTRThermal Conductivity
  - Thermal Analysis
    - Differential Scanning Calorimeter, DSC-L600Heat Flow, TG, Specific Heat
    - Thermogravimetric Analyzer, TGA-1000 & TGA-1500Integrated Temperature & Automation
- Property
- Material Type
  - Solids
    - HFM-100Homogeneous & Heterogeneous Insulation
    - TLS-100Concrete, Rocks, Polymers
    - GHFM-02Homogeneous, Heterogeneous, Metals & Composites
    - MP-2Concrete, Rock, Polymers, and Insulation
    - SSTR-FCoatings, Thin-films, and Bulk materials
  - Liquids
    - THW-L1Liquids, Temperature & Pressure
    - THW-L2Liquids, Temperature & Pressure
    - MP-2Liquids
    - SSTR-FLiquids
  - Pastes
    - TLS-100Paste up to 5 W/mK
    - THW-L1Paste up to 2 W/mK
    - THW-L2Paste up to 2 W/mK
    - GHFM-02Paste up to 15 W/mK
    - MP-2Paste up to 5 W/mk
  - Powders
    - TLS-100Soil, Small to Medium Particle Size
    - MP-2Small to Medium Particle Size
- Material Characteristics
  - Isotropic / Homogeneous
    - HFM-100Insulation and Construction Materials
    - TLS-100Soil, rock & polymers
    - THW-L1All Liquids
    - THW-L2All Liquids
    - GHFM-02Composites & polymers
    - TPS-EFFTextiles, fabrics & solids
    - MP-2Solids, Liquids, Pastes, Powders, Textiles, and Insulation
    - SSTR-FAll Solids and Liquids
  - Heterogeneous
    - HFM-100Large sample size
    - GHFM-02Medium sample size
    - TPS-EFFMedium sensor for medium sample volume
    - MP-2medium sensor for medium sample size
    - SSTR-FAll Solids and Liquids
  - Anisotropic
    - HFM-100Out-of-plane
    - GHFM-02Out-of-plane
    - TPS-EFFOut-of-plane
    - MP-2Out of plane
    - SSTR-FAll Solids and Liquids
- ASTM/ISO/EN
  - Column 1
    - HFM-100ASTM C518-17, ISO 8301:1991, EN 12667
    - TLS-100ASTM D7896-14, IEEE 4442-1981
    - THW-L1ASTM D7896-19
    - THW-L2ASTM D7896-19
    - GHFM-02ASTM E1530-19
    - TPS-EFFASTM D7984-16
    - MP-2D7984-16, D7896-19, IEEE 442-1981
  - Column 2
    - DSC-L600ASTM/ISO
    - TGA-1000ASTM/ISO
    - TGA-1500ASTM/ISO
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Keyword: diameter

Total Papers Found: 4

Effect of carbon nanotube interfacial geometry on thermal transport in solid–liquid phase change materials

Author(s): Amy S. Fleischer, Ronald J. Warzoha

The thermal conductivities of four composite paraffin phase change materials (PCMs) containing embedded multi-walled carbon nanotubes (MWCNTs) with varying dimensions were determined. The goals of this study were to investigate ...

Keywords: Aspect Ratio, Carbon nanotubes, CNTs, composite, density, diameter, Fillers, Interfacial Thermal Resistance, Length, pcms, phase change materials, Thermal Conductivity, Thermal Diffusivity, TPS Device, Transient Plane Source, Transient Plane Source (TPS) Device

Filler geometry and interface resistance of carbon nanofibres: Key parameters in thermally conductive polymer composites

Author(s): Andre Boden, Gregor J. F. Czempiel, Izabela Firkowska, Kati Gharagozloo-Hubmann, Stephanie Reich

The effects of intrinsic thermal conductivity, carbon filler geometry, and interface thermal resistance on the effective thermal conductivity of polymer composites were investigated. It was found that the length of ...

Keywords: Aspect Ratio, diameter, Fillers, Interface Thermal Resistance, Length, Polymer composites, Scanning Electron Microscopy, Scanning Electron Microscopy (SEM), SEM, TEM, Thermal Conductivity, Transmission electron microscopy, Transmission electron microscopy (TEM)

Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives

Author(s): Jin Kon Kim, Jong Won Kim, Min Seok Song, Myung Im Kim

Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the ...

Keywords: 2-ethylexyl acrylic polyol, Adhesion properties, Coupling agent, cross linking, diameter, matrix, particle, particle size, resin, strength, Thermal barrier, Thermal Conductivity, thermal transport properties, Transient plane source (TPS), Transient plane source (TPS) method, Ultraviolet

Synthesis of hollow silica nanospheres by sacrificial polystyrene templates for thermal insulation applications

Author(s): Arild Gustavsen, Bjorn Petter Jelle, Linn Ingunn C. Sandberg, Tao Gao

In this paper, researchers synthesized monodispersed polystyrene spheres (PS), of a desired size. Generally, PS have a typical diameter ranging from 180 nm to 900 nm. However, the researchers in this study ...

Keywords: Coatings, diameter, hollow silica nanosphere, hollow silica nanosphere (HSNSs), HSNSs, monodispersed polystyrene spheres, photon scattering, polystyrene sphere, polyvinylpyrrolidone, Polyvinylpyrrolidone (PVP), PVP, silica coating process, sphere size, Thermal Conductivity, thermal insulation

Keyword: diameter

Effect of carbon nanotube interfacial geometry on thermal transport in solid–liquid phase change materials

Filler geometry and interface resistance of carbon nanofibres: Key parameters in thermally conductive polymer composites

Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives

Synthesis of hollow silica nanospheres by sacrificial polystyrene templates for thermal insulation applications

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