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  - Column 1
    - HFM-100Heat Flow Meter
    - TLS-100Transient Line Source
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    - THW-L2Transient Hot Wire
    - GHFM-02Guarded Heat Flow Meter
    - TPS-EFFTransient Plane Source
  - Column 2
    - Hot Disk TPS
  - Column 3
    - DSC-L600Differential Scanning Calorimeter
    - TGA-1000Thermogravimetric Analyzer
    - TGA-1500Thermogravimetric Analyzer
- Category
  - Thermophysical Analysis
    - Heat Flow Meter, HFM-100Integrated Temperature & Automation
    - Transient Hot Wire, THW-L1 & THW-L2Thermal Conductivity, Thermal Diffusivity & Specific Heat
    - Transient line Source, TLS-100Thermal Conductivity & Thermal Resistivity
  - Thermal Analysis
    - Differential Scanning Calorimeter, DSC-L600Heat Flow, TG, Specific Heat
    - Thermogravimetric Analyzer, TGA-1000 & TGA-1500Integrated Temperature & Automation
- Property
- Material Type
  - Solids
    - HFM-100Homogeneous & Heterogeneous Insulation
    - TLS-100Concrete, Rocks, Polymers
    - GHFM-02Homogeneous, Heterogeneous, Metals & Composites
  - Liquids
    - THW-L1Liquids, Temperature & Pressure
    - THW-L2Liquids, Temperature & Pressure
  - Pastes
    - TLS-100Paste up to 5 W/mK
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    - THW-L2Paste up to 2 W/mK
    - GHFM-02Paste up to 15 W/mK
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    - TLS-100Soil, Small to Medium Particle Size
- Material Characteristics
  - Isotropic / Homogeneous
    - HFM-100Insulation and Construction Materials
    - TLS-100Soil, rock & polymers
    - THW-L1All Liquids
    - THW-L2All Liquids
    - GHFM-02Composites & polymers
    - TPS-EFFTextiles, fabrics & solids
  - Heterogeneous
    - HFM-100Large sample size
    - GHFM-02Medium sample size
    - TPS-EFFMedium sensor for medium sample volume
  - Anisotropic
    - HFM-100Out-of-plane
    - GHFM-02Out-of-plane
    - TPS-EFFOut-of-plane
- ASTM/ISO/EN
  - Column 1
    - HFM-100ASTM C518-17, ISO 8301:1991, EN 12667
    - TLS-100ASTM D7896-14, IEEE 4442-1981
    - THW-L1ASTM D7896-19
    - THW-L2ASTM D7896-19
    - GHFM-02ASTM E1530-19
    - TPS-EFFASTM D7984-16
  - Column 2
    - DSC-L600ASTM/ISO
    - TGA-1000ASTM/ISO
    - TGA-1500ASTM/ISO
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Keyword: matrix

Total Papers Found: 16

Preparation and thermal characterization of composite -oeParaffin/Red Brick- as a novel form-stable of phase change material for thermal energy storage

Author(s): Dihia Djefel, Gilles Lefebvre, Laurent Royon, Said Makhlouf, Souad Khedache

This study is to determine the thermal properties of a paraffin/red brick composite to determine its viability as a form-stable phase change material. Extended graphite was also added to ...

Keywords: characterization, composites, Differential scanning calorimetry (DSC), expanded, graphite, Hot Disk, laser particle size, latent heats, mass fraction, matrix, paraffin (PA), pcms, phase change materials, powder, red brick (Br), Scanning Electron Microscopy (SEM), Spectroscopy Infrared Fourier Transform (SIFT), Temperature, thermal energy storage, thermal reliability, Transient plane source (TPS), Transient plane source (TPS) method

An approach to correlate experimental and theoretical thermal conductivity of MWNT/PMMA polymer composites

Author(s): D. Patidar, K. B. Sharma, M. Verma, N. S. Saxena

This study is investigating how the thermal conductivity of a PMMA polymer filled with multi walled carbon nano tubes (MWNT) changes with temperature, and wt % MWNT. Also, the series, parallel, ...

Keywords: Carbon nanotubes, Casting Method, CNTs, concentration, Hot Disk, Hot Disk thermal constant analyser, matrix, Multiwalled carbon nanotubes, MWNT, MWNT/PMMA polymer, nanocomposites, PMMA polymer, Polymer composites, polymer interactions, Temperature, Thermal Conductivity, Transient Plane Source, Transient plane source (TPS) method

Transparent silicone calcium fluoride nanocomposite with improved thermal conductivity

Author(s): Andre Bernard, Katrin Albrecht, Martina Brulisauer, Rene Schneider, Stefan R. Luthi, Thomas Geiger

The aim of this study was to fabricate transparent polymers with high thermal conductivities for applications in electronic packaging. Characteristics of the inorganic filler, calcium fluoride (CaF2), and the polymer ...

Keywords: Calcium fluoride (CaF2), elastomer, Electronic Devices, Fillers, films, Heat dissipation, Homogeneous, Hot Disk, matrix, microparticles, nanocomposites, Nanoparticles, Opaque, Polymer composites, Polymeric materials, powder, Refractive index, Silicone, Temperature, Thermal Conductivity, Transparency, Volume

Preparation and thermal properties of UV-curable polyacrylate-gold nanocomposite foams

Author(s): Chih-Wei Peng, Jui-Ming Yeh, Kung-Chin Chang, Mei-Chun Lai, Pei-Shan Wu, Wei-I Hung, Yen-Hao Lin

The purpose of this study was to fabricate and analyze the physical properties of polyacrylate–gold nanocomposites (PGNs) with gold nanoparticles (GNPs) as their nucleation agents. The transient plane source (...

Keywords: 2-hydroxyethyl methacrylate (HEMA), Cell structure, density, Foams, Gold, matrix, Mechanical Strength, Methyl methacrylate (MMA), Monomers, nanocomposites, Nanoparticles, Nitrogen, Photopolymerization, Polyacrylate-gold nanocomposites (PGNs), Polymer composites, Scanning Electron Microscopy (SEM), Temperature, Thermal Conductivity, Thermal Diffusivity, thermal stability, Transient plane source (TPS), Transient plane source (TPS) method, Transmission electron microscopy (TEM), UV

Carbon nanotubes based engineering materials for thermal management applications

Author(s): I. Firkowska, K. Gharagozloo-Hubmann, M. Lisunova, V. Datsyuk

As nanotechnology becomes increasingly important, researchers are investigating methods to decrease the size of electronics. Carbon nanotubes (CNTs) have potential applications in nanoelectronics because of their high thermal conductivity and ...

Keywords: Alignment, Carbon nanotubes, ceramics, CNTs, Coefficient of thermal expansion (CTE), Copper, Electrospinning, Environmentally friendly thermal grease, In situ thermal polymerization, Liquid Crystal, matrix, Natural oils, Polymer composites, Semiconductors, Thermal Conductivity, thermal grease, Transient plane source (TPS), Transient plane source (TPS) method

Biomass-derived, thermally conducting, carbon foams for seasonal thermal storage

Author(s): Alain Celzard, Antonio Pizzi, P. Jana, V. Fierro

Seasonal thermal storage based on phase change materials (PCMs) require a thermally conductive host because they typically have low thermal conductivities. In this study, tannin-based composite carbon foams were prepared ...

Keywords: Biomass, Carbon Foams, Composite foams, Environment friendly, Exfoliated, Fillers, Formaldehyde, graphite, Hot Disk, matrix, mechanical properties, Organic foams, pcms, phase change materials, Porous, resin, Storage, strength, Tannin, Temperature, Thermal Conductivity, Transient plane source (TPS), Transient plane source (TPS) method

Enhanced thermally conductivity and mechanical properties of polyethylene (PE)/boron nitride (BN) composites through multistage stretching extrusion

Author(s): Hong Wu, Liyuan Shen, Shaoyun Guo, Xianlong Zhang

This study aimed to enhance the thermal and mechanical properties of polyethylene (PE)/boron nitride (BN) composites by manipulating the BN concentrations in the matrix and by applying shear fields ...

Keywords: BN, boron nitride, composites, concentration, crystal, Dispersion, Fillers, Heat conductive model, Impact Strength, matrix, mechanical properties, particles, Polyethylene (PE), Rheological, Scanning electron microscope (SEM), Shear field, Storage modulus, Stretching extrusion, tensile strength, Thermal Conductivity

Thermal conductivity of nanoporous glass alumina film and composites

Author(s): Congliang Huang, Ge Wang, Xinxin Zhang, Yanhui Feng

The thermal conductivity of nanoporous glass alumina films (NGAFs) were theoretically and experimentally studied in this paper. The thermal conductivity of pristine NGAFs and silver nanowire-infused NGAFs of various pore ...

Keywords: Ceramic alumina, ceramics, Contact resistance, Cross plane, films, glass, Hot Disk, matrix, nanocomposites, Nanopores, Nanoporous glass alumina film (NGAF), nanowires, Pore radius, Silver, Thermal Conductivity, Transient plane source (TPS) porosity

Mechanical, thermal and electrical properties of aluminum nitride/polyetherimide composites

Author(s): Chen-Chi M. Ma, Chih-Chun Teng, Sheng-Yen Wu, Shi-Yi Yang, Siu-Ming Yuen, Yuan-Li Huang

In this study, aluminum nitride was treated with silane in an attempt to improve the performance of polyetherimide (PEI) composites. Various properties of the modified AlN/PEI composites were examined ...

Keywords: Adhesion, Aluminum nitride (AlN), composites, Dielectric properties, Electrical properties, matrix, mechanical properties, Polyetherimides (PEI), Silane, Silane composites, strength, Thermal Conductivity, Thermal Properties, thermal stability, Wetibility

Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives

Author(s): Jin Kon Kim, Jong Won Kim, Min Seok Song, Myung Im Kim

Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the ...

Keywords: 2-ethylexyl acrylic polyol, Adhesion properties, Coupling agent, cross linking, diameter, Hot Disk, matrix, particle, particle size, resin, strength, Thermal barrier, Thermal Conductivity, thermal transport properties, Transient plane source (TPS), Transient plane source (TPS) method, Ultraviolet