Thermal Conductivity Paper Database

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Recommended Papers for: Jin Kon Kim

Total Papers Found: 1

Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives

Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the thermal conductivity of TC-PSA. A thermophysical properties analyzer measured the thermal conductivity of the particle-filled ...

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