Thermally conductive pressure-sensitive adhesives (TC-PSA) are used in electronic devices and industrial applications. This paper examined how particle size, shape, and the addition of a coupling agent (GSP) affected the thermal conductivity of TC-PSA. A thermophysical properties analyzer measured the thermal conductivity of the particle-filled polymer using the transient plane source (TPS) method. Results showed that the thermal conductivity of the particles increased with diameter and aspect ratio, and the ...
