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Recommended Papers for: Electronic Device Junction Temperature

Total Papers Found: 1

Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging 

Diamond powders with various particle sizes were dispersed in an epoxy resin in an effort to increase its thermal conductivity. Dispersion of a mixture of particle sizes from 1 to 100 µm resulted in a thermal conductivity of 4.1 W/m·K which is a substantial increase in comparison to the thermal conductivity of the pure epoxy. The electronic device junction temperature between a Si PiN diode chip and a 64 vol. % diamond-epoxy flowable ...

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