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Recommended Papers for: Thermal management systems

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Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites 

Diamond is an extremely conductive material that would be ideal for dissipating heat in microelectronics if it were not for its high price tag. In this study, cost effective copper- and chromium-diamond composites (uncoated (Cu/D), Cu-coated (Cu/CuD), and Cr-coated (Cu/CrD)) were produced to determine their potential use in heat sink applications. A Thermal Constant Analyzer measured the thermal conductivity of the matrix and composite samples using the ...

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