This article examined how a variety of mechanisms (layering, Brownian motion, clustering, ballistic phonon motion, thermal boundary resistance, and mass difference scattering) affect the thermal conductivity of alumina based nanofluid. The thermal conductivity values were found using the transient plane source (TPS) method. It was found that mass difference scattering provided the most effective mechanism for reducing the thermal conductivity of the alumina based nanofluid....
The thermal conductivity and thermal boundary resistance between ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on silicon wafers were evaluated. It was found that the MCD/Si composite wafers were more thermally conductive than the UNCD/Si wafers over the temperature range tested. It was also found that in both types of composite wafer, the thermal conductivity increased with temperature in contrast to the decrease that is observed in ...
The authors outline a method of enhancing the thermal properties of a paraffin phase change material through the addition of herringbone-style graphite nanofibers (HGNFs). It was found that the solid-phase thermal conductivity increased exponentially with the presence of HGNFs; however, a significant increase in the liquid-phase thermal conductivity was not observed until the concentration of HGNFs in the composite PCM reached a point above the percolation threshold. The volumetric heat ...
Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of ...
