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Recommended Papers for: Adhesive Bonding Measurement

Total Papers Found: 1

Enhanced thermal and mechanical properties of epoxy composites filled with silver nanowires and nanoparticles

The authors have investigated the use of silver nanomaterials as a filler in epoxy resin in an effort to identify a composite resin with a high thermal conductivity for application as a thermal interface material. It was determined that the addition of silver nanoparticle and silver nanowires both increased the thermal conductivity of the resin, but the silver nanowires caused a much more drastic increase. It was found that by ...

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