Category: Transient Plane Source
Author(s): Dan Dan, Hu Zhang, Ming-Jia Li, Wen-Quan Tao, Wen-Zhen Fang, Zeng-Yao Li
Keywords: Bulk material, bulk materials, Cement, films, heat conduction, Sensor, sensor insulation, Thermal Conductivity, Thermal Resistance, thickness, thin film module, thin films, Transient plane source (TPS) method
Abstract: Currently, there is no research into the accuracy of the transient plane source (TPS) method for measuring the thermal conductivity of thin films. The purpose of this study is to use numerical simulation to determine the accuracy of thermal conductivity measurements of thin films, with the TPS method. The values produced from the TPS method closely resembled those of the numerical simulation. The deviations from the numerical model were caused by the assumption in the TPS method that the sensor is a plane source, with infinitely small thickness. The deviation has an exponential decay trend as the thermal resistance is increased.
Reference: Applied Thermal Engineering, 72, 1 (2014) 62-69