Select Page
Author(s): A. Ortega, P. E. Havey, W. D. Drotning
Transient Line SourceAqueous foams with densities from 0.03 to 0.2 g/cm3 were studied for their thermal conductivity. It is important to determine an aqueous foam's thermal response because it is often ...
Keywords: aqueous foams, density, full intergral, geothermal drilling fluids, heat conduction, heat conduction equation, helium foams, nitrogen foams, Thermal Conductivity, TLS, Transient Line Source
Read MoreAuthor(s): Dan Dan, Hu Zhang, Ming-Jia Li, Wen-Quan Tao, Wen-Zhen Fang, Zeng-Yao Li
Transient Plane SourceCurrently, there is no research into the accuracy of the transient plane source (TPS) method for measuring the thermal conductivity of thin films. The purpose of this study is to ...
Keywords: Bulk material, bulk materials, Cement, films, heat conduction, Sensor, sensor insulation, Thermal Conductivity, Thermal Resistance, thickness, thin film module, thin films, Transient plane source (TPS) method
Read MoreAuthor(s): Heping Zhang, Lunlun Gong, Ruifang Zhang, Xudong Cheng, Yonghong Wang
Transient Plane SourcePorous materials have widespread industrial applications. In this study, mullite materials with porosities between 72-86 vol% were fabricated and a hot-disk thermal analyzer (TPS2500s) measured their thermal conductivity using ...
Keywords: composites, Effective medium theory (EMT) equation, foaming, heat conduction, Maxwell-Eucken Model, Microstructure, porosity, Porous mullite, Starch consolidation, Temperature, Thermal Conductivity, Transient plane source (TPS), Transient plane source (TPS) method, Uniformity
Read MoreAuthor(s): In Lee, Ji-Hoon Choi
Transient Plane SourceUsing the transient method, the thermoelastic properties of disk brakes are studied. Specifically, frictional heat generation is studied using the finite element method. In addition to this, the investigators looked ...
Keywords: Disk Brakes, finite-element method, heat conduction, Phenomenon, TE, TEI, Thermoelastic, Thermoelastic (TE), Thermoelastic Instability, Thermoelastic Instability (TEI) Phenomenon, Transient Analysis
Read MoreAuthor(s): H. Wang, J. Y. Feng, K. M. Ng, X. J. Hu
Transient Plane SourceThermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the ...
Keywords: Carbon nanotubes, CNTs, Copper, elastomer, heat conduction, heat source, Heat Transfer, laser flash method, pressure, thermal conductivit, Thermal Conductivity, thermal contact resistance, thermal interface materials, thermal management, TIMs
Read More