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Thermal Conductivity Paper Database

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Recommended Papers for: heat conduction

Total Papers Found: 5

Thermal conductivity of aqueous foam

Aqueous foams with densities from 0.03 to 0.2 g/cm3 were studied for their thermal conductivity. It is important to determine an aqueous foam's thermal response because it is often used as a geothermal drilling fluid. In this paper, both helium and nitrogen foams were used each with a different bubble size range. The data was collected using transient line source probe ...

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A numerical study on the theoretical accuracy of film thermal conductivity using transient plane source method 

Currently, there is no research into the accuracy of the transient plane source (TPS) method for measuring the thermal conductivity of thin films. The purpose of this study is to use numerical simulation to determine the accuracy of thermal conductivity measurements of thin films, with the TPS method. The values produced from the TPS method closely resembled those of the numerical simulation. The deviations from the numerical model were caused ...

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Thermal conductivity of highly porous mullite materials

Porous materials have widespread industrial applications. In this study, mullite materials with porosities between 72-86 vol% were fabricated and a thermal analyzer (TPS) measured their thermal conductivity using the transient plane source (TPS) technique. Results showed that as the porosity of the mullite materials decreased, thermal conductivity increased....

Author(s): , , , ,

Finite element analysis of transient thermoelastic behaviors in disk brakes

Using the transient method, the thermoelastic properties of disk brakes are studied. Specifically, frictional heat generation is studied using the finite element method. In addition to this, the investigators looked into the thermoelastic instability (TEI) phenomenon in order to modify the conceptual design of disk brakes....

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Reducing thermal contact resistance using a bilayer aligned CNT thermal interface material

Thermal Interface Materials (TIMs) are used in the field of electronics, to reduce the thermal contact resistance between the heat sink and heat source, to improve heat dissipation within the electronic device. In this experiment, researchers created a TIM by synthesizing Carbon Nano-Tubes (CNTs) on both sides of a thin copper foil. To test the thermal conductivity of the foil with this enhancement, the transient plane source method was employed. ...

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