Join us at the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES).
In this study, aluminum nitride was treated with silane in an attempt to improve the performance of polyetherimide (PEI) composites. Various properties of the modified AlN/PEI composites were examined including the thermal conductivity by way of a thermal analyzer based on the transient plane source (TPS) method. Results showed that the AlN filler improved dispersion and interface of the matrix which enhanced the thermal conductivity of the PEI composites....
As electronic devices approach nanometer scales, heat distribution becomes nonuniform and hot spots begin to form. Integrating graphene into nanoelectronics enhances thermal conductivity and heat flow which mitigates hot spots. In this experiment, large quantities of graphene were produced and thermal conductivity was measured by the transient plane source (TPS) method using an instrument. Results showed that the addition of graphene greatly improved the thermal conductivity of the thermal interface ...
The development of higher power chips in the electronics industry has led to the requirement of high performance thermal interface materials (TIMs) due to the increased heat output by these chips. Desirable features of a high performance TIM include that the material be highly thermally conductive, and that it should have a relatively low viscosity. Companies can spend long periods of time trying to find the amount of filler content ...
Through the dispersion of graphite nanoplatelets in a silicone matrix and mechanical mixing, graphite nanoplatelet/silicone composites were prepared. These composites were subsequently analyzed by the transient plane source (TPS) technique in order to determine thermal conductivity. DSC and XRD were used to further characterize the composites....
Thermal interface resistance results from small gaps and surface geometry mismatches between two materials that make up a composite. Thermal interface resistance is present in most any material that is comprised of two or more components. In the field of thermal interface materials, the majority of novel materials are composites, and thus are subject to thermal interface resistance and thermal boundary resistance (thermal discontinuity at a perfectly bonded interface of ...
