Category: Transient Plane Source
Keywords: Adhesion, Aluminum nitride (AlN), composites, Dielectric properties, Electrical properties, matrix, mechanical properties, Polyetherimides (PEI), Silane, Silane composites, strength, Thermal Conductivity, Thermal Properties, thermal stability, Wetibility
Abstract: In this study, aluminum nitride was treated with silane in an attempt to improve the performance of polyetherimide (PEI) composites. Various properties of the modified AlN/PEI composites were examined including the thermal conductivity by way of a Hot Disk thermal analyzer TPS2500 based on the transient plane source (TPS) method. Results showed that the AlN filler improved dispersion and interface of the matrix which enhanced the thermal conductivity of the PEI composites.
Reference: Composites Part A: Applied Science and Manufacturing, 42, 11 (2011) 1573- 1583