Thermal Conductivity Paper Database

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Recommended Papers for: Thermal Conductivity

Total Papers Found: 893

An experimental investigation of melting of nanoparticle-enhanced phase change materials (NePCMs) in a bottom-heated vertical cylindrical cavity

A nanoparticle-enhanced phase change material (NePCM) is prepared by the dispersal of carbon nanotubes in 1-dodecanol. The objective of this experiment was to determine if the addition of nanoparticles could increase the thermal conductivity of the base PCM while resulting in a NePCM that would still have the required properties of a functional PCM. It was found that the thermal conductivity was enhanced through the addition of the carbon nanotubes; ...

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Temperature dependent ultrasonic and thermo-physical properties of polyaniline nanofibers reinforced epoxy composites

Nanocomposites of polyaniline nanofibers reinforced in epoxy were prepared and their ultrasonic velocities, ultrasonic attenuations, and thermal conductivities were measured over a temperature range of 298-373 K. It was found that the ultrasonic velocity decreased with increasing temperature, but increased with increasing concentration of polyaniline nanofibers in the epoxy matrix. These two trends were opposite for the ultrasonic attenuation, and the thermal conductivity was found to increase with increasing temperature ...

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Thermal Conductivity of Monodisperse Silica Nanospheres

Monodisperse hollow silica nanospheres with an outer diameter of ~300nm were prepared for the comparison of thermal conductivity with similar solid silica nanospheres. It was found that the thermal conductivity of the hollow nanospheres was lower than that of the solid silica nanospheres....

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Thermal Properties and Thermal Modeling of Ballistic Clay Box

In order to test the protective capabilities of body armor, a clay box is placed behind the armor during testing and the penetration depth into the clay is measured after firing. Procedures for the preparation of the Plastilina clay used to make these boxes require that the clay be pre-conditioned in an oven prior to testing. The objectives of this work were to determine if the cooling of the clay ...

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Effect of filler arrangement and networking of hexagonal boron nitride on the conductivity of new thermal management polymeric composites

Hexagonal boron nitride (h-BN) was used as filler in varying concentrations to form composite polymers with polyactic acid, polyamide, and polyphenylene sulfide. The objective of this work was to produce a composite polymer with a high thermal conductivity for use as electronics packaging. It was determined that although thermal conductivity increased with increasing filler content, it was not necessarily due to the increased number of filler particles present, but rather ...

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