The transient plane source (TPS) method, was used for the determination of thermal conductivity and thermal diffusivity of solid materials. Researchers developed a model based on the thermal quadrupoles formalism to represent the temperature variation. This model was able to take in account the thermal contact resistance of the material and the thermal inertia. The TPS method makes it possible to calculate the parameters estimation on all the recorded temperature ...
Nanoparticle-enhanced phase change materials (NePCMs) are nanofluids that can be used for thermal energy storage when they undergo solid-liquid phase transitions. In this study, a Thermal Constants Analyzer (TPS) measured the thermal conductivity of eicosane-based NePCM samples using the transient plane source (TPS) method. Results showed that thermal conductivity of the solid composites increased with temperature, and eicosane-CuO samples that solidified in an ice-water bath had the lowest thermal conductivities, ...
Polyoxymethylene (POM) is a resistant polymer with wide applications in aerospace, automotives, and biomedicine. However, it falls short when used in the manufacturing of sliding parts. In this study, copper particles and polytetrafluoroethylene (PTFE) powder were incorporated into POM to improve the thermal conductivity of the polymer composite while reducing the friction coefficient. A thermal analyzer was used to measure the thermal conductivity of POM composites using the transient plane ...
In this study, the thermal properties of stainless steel, ceramic, and silica aerogels were numerically calculated and then compared to actual test results. A thermal constants analyser measured the thermal conductivities and thermal diffusivities of the samples using the transient plane source (TPS) method. Results showed that the values generated by the numerical simulation were within ±3% of the TPS method values, which verifies the reliability and accuracy of the numerical ...
As technology advances, improving the efficiency of heat dissipation by thermal adhesives in electronic devices is becoming increasingly important. In this study, a thermal constants analyzer measured the thermal conductivities of eight different epoxy resin thermal adhesives using the transient plane source (TPS) method. Results showed that the layer-structure fillers enhanced the thermal conductivity of the epoxy matrix the most, while the sharp corner-shaped fillers had the lowest impact on ...
