Category: Transient Plane Source
Author(s): Hu Zhang, Wei Gu, Wen-Quan Tao, Yu Jin, Zeng-Yao Li
Keywords: accuracy, ceramics, Heat loss, Insulation layer, Kapton 5501, Mica 5082, Radius, Sensors, Silica aerogel, Stainless steel, Thermal Conductivity, thermal contact resistance, thermal transport properties, Transient plane source (TPS), Transient plane source (TPS) method
Abstract: In this study, the thermal properties of stainless steel, ceramic, and silica aerogels were numerically calculated and then compared to actual test results. A thermal constants analyser measured the thermal conductivities and thermal diffusivities of the samples using the transient plane source (TPS) method. Results showed that the values generated by the numerical simulation were within ±3% of the TPS method values, which verifies the reliability and accuracy of the numerical model.
Reference: Progress in Computational Fluid Dynamics, 113, 3/4 (2013) 191-201