Category: Transient Plane Source
Keywords: composites, Copper, Fillers, films, Friction Coefficient, particles, Polyoxymethylene (POM), Polytetrafluoroethylene (PTFE), Thermal Conductivity, Thermal properties testing, Transient plane source (TPS), Transient plane source (TPS) method, Tribological behavior, Wear rate
Abstract: Polyoxymethylene (POM) is a resistant polymer with wide applications in aerospace, automotives, and biomedicine. However, it falls short when used in the manufacturing of sliding parts. In this study, copper particles and polytetrafluoroethylene (PTFE) powder were incorporated into POM to improve the thermal conductivity of the polymer composite while reducing the friction coefficient. A Hot Disk thermal analyzer was used to measure the thermal conductivity of POM composites using the transient plane source (TPS) method. Results showed that the copper particles increased the thermal conductivity of the polymer composite, but the PTFE powder had no effect.
Reference: Journal of Macromolecular Science, Part B: Physics, 50, 10 (2011) 2023-2033